中文 英语

包装复杂性上升

为什么先进的包装仍然如此困难。

受欢迎程度

synopsys.’ Rita Horner looks at the design side of advanced packaging, including how tools are chosen today, what considerations are needed for integrating IP while maintaining low latency and low power, why this is more complex in some ways than even the most advanced planar chip designs, and what’s still missing from the tool flow.



1评论

查尔斯·诺兰 说:

美国专利4,845,426环境温度控制允许在晶片上进行全参数测试,以提供用于构建环形处理器或模块的已知良好模具。

发表评论


(注意:此名称将被公开显示)